The U.S. Department of Commerce (DOC), as represented by the National Institute of Standards and Technology (NIST), and the U.S. Department of Energy (DOE) , announced a memorandum of understanding (MOU) signed earlier this year to collaborate on safety research, testing, and evaluation of advanced artificial intelligence (AI) models and systems. This partnership is a key example of the Biden...

Program will increase the research capacity of emerging research institutions and the entire U.S. semiconductor innovation ecosystem Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation...

Today, U.S. Secretary of Commerce Gina Raimondo announced the appointment of eleven public safety, technology, and business leaders to the Board of the First Responder Network Authority (FirstNet Authority) and the selection of a new Board Chair. The Board now reaches a full complement, with 12 non-permanent members selected by the Department of Commerce and three permanent seats occupied by the U...

Leading up to the inaugural convening of the International Network of AI Safety Institutes , Commerce Department highlights implementation of President Biden’s historic AI Executive Order, which tasked the Department with numerous responsibilities to spur the safe development, deployment and adoption of responsible AI. Today, U.S. Secretary of Commerce Gina Raimondo marked the one-year anniversary...

Building on HSC’s Decades-Long Presence in Michigan, Proposed CHIPS Investment Would Help Strengthen Supply Chain Resilience and Create Over 1,000 Manufacturing and Construction Jobs Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in...

Program will drive U.S. leadership in semiconductors as well as provide the critical technology and skilled workforce needed for U.S. semiconductor packaging Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO ) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor...

Proposed CHIPS Funding Would Support Construction of Fab and Advanced Test and Packaging Facility and Create up to 1,700 Jobs in Pennsylvania and California Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science...

Proposed CHIPS Investment of up to $750 Million Would Support Construction of World’s Largest Silicon Carbide 200mm Ecosystem and Create Over 5,000 Jobs in North Carolina and New York Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed...